Pasta za CPU hladnjak GEMBIRD TG-G1.5-01

Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive Specifications Weight: 1.5 g Color: grey Thermal conductivity: > 4.5 W / mK Thermal Impedance <0.205 C-in2 / W Density: > 2.5 Evaporation: <0.001 % Volatility: <0.005 % The dielectric constant: > 5.1 Dissipation Factor: <0.005 Viscosity: 76 CPS Thixotropic index: 310 ± 10 C Operating Temperature: -50 240 C Composites: 50% silicone compounds Compounds: 30% of carbon The compounds of metal oxides: 20%